Advanced Material Fine ceramic products of semiconductor equipment

Pulse Heat Tools

Features

・The heat tool for semiconductor bonding process.
・Excellent thermal response and uniformity by generating the heat from the SiC ceramic itself.
・The heat reaches at the max rate of 200C/sec.
・Enable to achieve pulse heating with the minimum of 500W electric power.
・ (Only for the operation of 12 x 12mm heat tool without attachment)
 The available sizes are: 12 x 12 mm, 22 x 22 mm, 35 x 35 mm

Production
code
Size Recommended
object size
max.
temperature
max.
heat rate
Cooling
time
Temperature
uniformity
PHT-12 12×12mm ~7mm 450°C 200°C/sec 2.4sec*1 ±6℃
(450℃, within 5mm□)
PHT-22 22×22mm ~15mm 450°C 200°C/sec 4.7sec*1 ±5℃
(450℃, within 5mm□)
PHT-35 35×35mm 15~25mm 450°C 150°C/sec 7.6sec*1 ±9℃
(450℃, within 5mm□)

Without attachment (Heat tool only), Apply only internal cooling line 0.5MPa – 1 source.

22 x 22mm Pulse Heat Tool PHT-22

22 x 22mm Pulse Heat Tool PHT-22

Fig.2 Time chart of heater performance
(Heat tool only)

emperature uniformity on the attachment

Fig.3 Temperature uniformity on the attachment
(measured by infrared thermometer)

PDF Download(English)
To Product and service introduction
For inquiries regarding
Optoelectronics Business
Contact Us
PageTop